SURFACE
MOUNT ASSEMBLY
 In
order to meet the demands of our customers, API has state-of-the-art
Surface Mount Assembly Equipment.
For mid to high
volume fine pitch applications, including ball grid arrays, our
process control equipment ensures quality & reliability. We
also have semi-automatic machines for low volumes.
- Low
& High Volume Surface Assembly
-
Contact 3S Automatic Surface Mounter
-
Cyber-Optics Paste Inspector - 3 Dimensional solder paste inspection
-
Fuji Chip Shooter
- Universal
GSM2
-
MPM AP25 Screen Printer
-
BTU Paragon 150 Convection Reflow Oven
Our
High-Speed Automatic Line features:
- MPM
paste screening equipment
-
Cyber-Optics paste inspector
-
Fuji CP-IV chip shooter
-
Universal GSM for fine pitch placement
-
Paragon 150 Convection re-flow oven
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